Sapphire Nitro+ Radeon RX 7900 XTX Vapor-X OC 24GB GDDR6 Graphics Card

• GPU: Boost Clock: Up to 2680 MHz
• GPU: Game Clock: Up to 2510 MHz
• Memory: 24GB/384 bit DDR6. 20 Gbps Effective
• Stream Processors: 6144
• RDNA™ 3 Architecture
• Ray Accelerator: 96

Software BIOS Switch

Switch from OC BIOS to Secondary mode or back using our TriXX software for a quick and easy switch between your dual BIOS modes.

Vapor-X Cooling

The Vapor Chamber is mounted in contact with the surface of the main chip and memory. Since the entire area transfers heat at the same rate, the Vapor-X module has been engineered to operate more efficiently than a copper heat sink at carrying away heat. Upon gaining heat, the heat source is pushed to the Vaporization Wicks to begin the heat dissipation process. Due to extreme low pressure, working fluid and pure water are easily vaporized, and transferred through the vacuum until reaching the Condensing Wick which is adjacent to the cooled surface. From here, it turns back to a liquid state whereby the liquid is then absorbed into the Transportation Wick by capillary action and moved back towards the Vaporization Wick. A recycled liquid system occurs when the heat source reheats the liquid and it becomes re-vaporized by the Vaporization Wick to restart the Vapor-X Cooling process.

Die Casted Aluminum-Magnesium Alloy Frame & Frontplate Heatsink

The Die Casted Aluminum-Magnesium Alloy Frame enveloping the sides of the PCB help to strengthen the structural stiffness of the shroud to create a strong, scratch resistant and high quality finish that elevates the aesthetic and strength of the graphics card. Overlaying the entire PCB, the die casted Frontplate Heatsink cools the VRM, Memory and Chokes resulting in superior heat dissipation for top-notch airflow and cooling performance.

Digital Power Design

SAPPHIRE NITRO+ & PULSE AMD Radeon™ RX 7900 Series are designed with digital power which provides accurate power control and excellent power efficiency

High TG Copper PCB

The GPU is mounted on to the high-density 14 layer 2oz Copper and high TG PCB to match the rapid speed, high current and increased power requirement of the GPU and memory to guarantee high stability of the PCB during operation.

Tough Metal Backplate

The all-aluminum backplate provides additional rigidity that guarantees nothing bends and dust stays out. It also helps cool your card by increasing heat dissipation.

Dedicated VRM Cooling

Dedicated VRM cooling module to create optimal heat dissipation for peak airflow and cooling performance.

Angular Velocity Fan Blade

The Angular Velocity Fan Blade provides a double layer of downward air pressure which alongside the air pressure on the outer ring of the Axial fan, results in up to 44% more downward air pressure and up to 19% more airflow for a quieter and cooler operation when compared to the previous generations.

Optimized Composite Heatpipe

The composite heatpipes are fine-tuned for each individual cooling design with optimal heat flow, efficiently and evenly spreading out the heat to the entire cooling module.

Fuse Protection

In order to protect your card, the SAPPHIRE cards have fuse protection built into the circuit of the external PCI-E power connector to keep the components safe.

Dual ARGB Light Bar

With tasteful shroud design augmented by ARGB LEDs, you can change the colors of the LED, for a customized design. This can be controlled via TriXX software. Choose from different modes including Fan Speed Mode, PCB Temperature Mode or the colourful rainbow mode or turn off the LEDs.

TRI-X COOLING TECHNOLOGY

An innovative mixture of Robust VRM Cooling and independent memory thermal modules work in tandem to remove heat efficiently and effectively across all sections. Heat is dissipated by a trio of large efficient fans running anticlockwise to maximize airflow.